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产品名称:芯片成型系统
产品型号:Fico MMS-LM
产品厂商:Besi
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Besi Fico MMS-LM 芯片成型系统


The Fico MMS-LM is a molding system for single sided products in MAP, such as BGA, QFN etc. The machine was especially developed for molding process parameter optimization. By making use of the original molds, new products can be developed and optimized prior to large scale production. Besides that, the Fico MMS-LM can be used for small production batches or offline cleaning of the molds that are used in the Fico AMS-LM.

Compatible

The user friendliness of the Fico MMS-LM creates the opportunity to quickly introduce new products by making use of test molds. As on the automatic version, the Fico MMS-LM can be used with V-pin molds. Especially in combination with high vacuum, V-pins allow full control of the cavity vacuum.

More information?

Curious of what the Fico MMS-LM can do for you? Contact the Besi sales department for more information.

Key Features
  • Top edge molding
  • 45 ton press station
  • Cavity vacuum control
  • Board vacuum
  • Adaptive clamping
  • Transfer pressure control
  • Dynamic clamping control

Machine Dimensions

Width 1,210 mm
Depth 1,020 mm
Height 2,012 mm
Weight Approx. 850 kg

 

Leadframe Dimensions

Width 65 - 102 mm
Length 100 - 280 mm
Thickness 0.1 - 1.5 mm
Height Max. 2 mm

 

Supply Requirements

Voltage 208-230-380-400-440-460-480VAC - 3~
Frequency 50 / 60 Hz
Power rating 7.5 kVA
Compressed air 5 - 10 bar
Average air consumption 1.5 m3/h at 6 bar
Factory exhaust 300 m3/h at 50 Hz

 

Press and Mold Properties

Max. clamp force 600 kN
Max. mold opening 90 mm
Max. transfer pressure 180 bar
Pellet diameter 11, 14 or 14.3 mm
Max. pellet length 45 mm
Max. number of plungers 10
Max. cavity temperature difference ± 2º C

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