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产品名称:成型系统
产品型号:Fico AMS-W
产品厂商:Besi
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Besi Fico AMS-W 芯片成型系统


The Fico AMS-W is the most economic and flexible MAP molding system, dedicated to the latest trend in single sided packaging. It is the molding solution for products like QFN, BGA, BOC and BGA-MAP, including high end applications such as flip chip, multi-chip array and stacked die.

More information?

Curious of what the Fico AMS-W can do for you? Contact the Besi sales department for more information.

Key Features
  • Clean room class 1000
  • Topedge gating
  • 45 tons press station
  • Transfer pressure control
  • Cavity vacuum control
  • Adaptive clamping
  • Semi S2/S8 compliant
  • Unwanted object detection in the press to prevent damage
  • Remaining cull detection when molded products are unloaded
  • Leadframe orientation check with automatic correction
  • Remote pellet feed with pellet length check
  • Product & lot tracking
  • Large cull bin, can be emptied while the machine continues production
  • User friendly touch screen with all machine manuals
  • Clean room class 1000 compatible
CE compliant
Width 2,272 mm
Depth 1,490 mm
Height 1,976 mm
Weight Approx. 2,600 kg

 

Leadframe Dimensions

Width 45 - 78 mm
Length 180 - 280 mm
Thickness 0.1 - 1.5 mm
Height Max. 2 mm

 

Cassette Dimensions

Width 48 - 85 mm
Length 180 - 300 mm
Height 100 - 165 mm
Storage capacity 400 mm

 

Supply Requirements

Voltage 208-230-380-400-440-460-480VAC - 3~
Frequency 50 / 60 Hz
Power rating 9 kVA
Compressed air 5 - 10 bar
Average air consumption 6 m3/h at 6 bar
Factory exhaust 300 m3/h at 50 Hz

 

Equipment Performance

Up time ≥ 98%
Max. throughput ca. 250 Lf/h
MTBF ≥ 200 h for every MTTR of 1 h
MTBA ≥ 3 h
MTTR ≤ 1 h
MTTA ≤ 3 min
Mold open time 16 sec

 

Press and Mold Properties

Max. clamp force 450 kN
Max. mold opening 90 mm
Max. transfer pressure 180 bar
Pellet diameter 11, 14 or 14.3 mm
Max. pellet length 45 mm
Max. number of plungers 10
Max. cavity temperature difference ± 2 ºC

The Fico AMS-W can be supplied in a variety of configurations according to your requirements. These configurations can include:

  • SECS/GEM
  • Thin Substrate handling
  • Side rail vacuum
  • V-pin mold
  • High end vacuum
  • Also available as manual machine
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