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产品名称:芯片焊接机
产品型号:Esec 2100 sDplus
产品厂商:Besi
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Besi Esec 2100 sDplus 芯片焊接机


The Esec 2100 sDplus, the 2nd generation of the proven Die Bonding Family, offers a wide range of benefits with the sole target of producing highest quality at lowest cost per die placement. Special handling and operating aspects of stacked die are incorporated in the revolutionary machine concept. Further redefining Stacked Die Bonding. For your benefit.

Key Features

12 µm Accuracy @ 3 Sigma (film based applications in High Accuracy Mode)

  • Revolutionary Phi-Y pick and place
  • Stable high accuracy thanks to vibration control
     

Widest Application Range

  • From epoxy to most advanced stacked die applications (amongst others BGA, CSP-BGA, SiP-BGA, FBGA)
  • Patented ultra thin die pick up solutions
  • 50 N bond force standard
  • Up to 125 mm substrate width
     

Shortest Time to Yield

  • Recipe transfer from machine to machine
  • Operator independent results due to auto calibration concept
  • Tool-less exchange of expansion unit in less than 30 seconds
     

Highest Up Time

  • 4 live camera pictures on display at all time
  • Strip and magazine viewers
  • Online help
  • Easy maintainability 
     

Platform of the Future

  • Third process station for additional process expansions
  • Expandable for the future thanks to revolutionary machine concept
Bonding method Epoxy and DAF
Cycle time 265ms
Bonding accuracy Down to 12 µm @ 3σ
Wafer size 4" to 12" (on 8" or 12" wafer frames)
Die size 0.25 mm (with Small Die Kit) to 20 mm
Strip dimensions Length: 90 mm to 300 mm
Width: 20 mm to 125 mm
Machine dimensions 1785 x 1448 x 1400 mm (W x D x H)

Substrate Handler

  • Dual Input (MHIN and TOS)
  • Magazine Handler Input (MHIN only)
  • Raildownholder
  • Motorized Downholder Disp/Bond
  • Strip Marking Unit
  • Striphandler 125 mm hot taped QFN
  • Striphandler 137 mm hot Stage Z
  • SMEMA Link Input
  • SMEMA Link Output
     

Dispenser

  • PDS Epoxy Level Detection
  • PDS Purge and Pre-Dispense Station
  • Multi Dispense Process
     

Pick & Place

  • Fusion Bond Process
  • Massflow Die Sensor
  • Small Die Kit
  • Parallel Pick & Place
  • High Accuracy Mode
     

Die Ejector

  • Ultra Thin Die Needle Module
  • Ultra Thin Die Peel (CSR required)
  • Ultra Thin Die Multidisc (CSR required)
     

Vision

  • Indirect Illumination (BVI/DVI)
  • Dispense Vertical Indirect Illumination (DVIILL)
  • Dispense Quality Check
  • Bond Quality Check
  • Bond Vertical Indirect Illumination (BVIILL)

Automation

  • Wafer Mapping inclusive Conversion
  • Host Communication Interface
  • E142 Strip Mapping (CSR required)
     

Miscellaneous

  • Uninterruptible Power Supply to PC
  • Ionizer Pick
  • Ionizer Bond
  • Ionizer Controlled Pick (IONC-P)
  • Ionizer Controlled Bond (IONC-B)
  • Ionizer Controlled Dispense (IONC-D)
  • Ionizer Controlled WH Load Top (IONC-WT)
  • Ionizer Controlled WH Load Bottom (IONC-WB)
  • Ionizer Controlled Magazine Input (IONC-MHIN)
  • Fine Filter Unit
  • Fine Filter Unit with Air Particle Sensor
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