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产品名称:晶圆检测系统
产品型号:9130
产品厂商:kla-tencor
欲购买或租赁晶圆检测系统
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kla-tencor 9130 晶圆检测系统

Product Description
 
The Puma 91xx Series is a family of laser imaging, darkfield patterned wafer inspectors that effectively disposition wafers and improve the predictability of the chipmaking process by capturing critical defects at high production throughputs. Part of a fab's yield management strategy, the Puma 91xx darkfield inspection tools provide etch pattern excursion monitoring capability for memory and logic devices at the 55/45nm nodes and beyond.
 
Unique optical modes and multiple pixel options provide broad defect type capture at required speed for a range of process layers
High production throughputs at required sensitivity enable increased lot sampling or lower cost of ownership
Modular design allows various tool configurations, spanning applications from tool monitoring to advanced etch and photo
Commonality and connectivity with KLA-Tencor's 23xx/28xx broadband brightfield inspectors and eDR-5200 review system optimize inspector capacity and reduce production integration time
Brightfield recipe import and recipe optimization on KLA-Tencor's eDR-5200 review system enable operators to produce more accurate Puma inspection recipes in less time
Established tool architecture and production-proven tool matching result in consistent and reliable excursion monitoring results
Applications
 
Films: With unique optical features that produce superior nuisance suppression and surface selectivity, the high throughput Puma 91xx defect inspectors provide cost-effective defect detection on all film layers.
 
CMP: Flexible polarization options and multiple optical modes minimize process variation and enhance critical CMP defect capture, enabling fast and sensitive tool monitoring for CMP interconnect processes.
 
Etch: Innovative laser imaging technology enables the detection of etch pattern defects (bridging, shorts), making the high throughput Puma 91xx inspectors well-suited for non-critical etch pattern excursion monitoring.
 
Photo and ADI: The higher throughput Puma 91xx tools complement higher sensitivity broadband brightfield defect inspections by providing an improved sampling option for photo-cell monitoring and after-develop inspection.
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